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Flussante in gel per saldatura.
Eccellente isolamento.
Consente di togliere i residui di ossido presenti nel conduttore con cui viene in contatto lo stagno nel momento della sua fusione.
Utilizzato spesso sulla saldatura dei componenti SMD, come PGA, BGA e PCB di cellulari. Indispensabile per riparare le schede circuito e mainboard di cellulari.
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